学术活动

电子器件石墨烯碳纳米管互连与散热研究新进展

活动品牌 大连理工大学-学术活动
主 讲 人 瑞典皇家工程科学院院士 刘建影教授
活动地点 材料学院后三楼报告厅
开始时间 2018-07-10 15:00
结束时间 2018-07-10 17:00

活动简介:

瑞典查尔莫斯理工大学刘建影教授学术报告

 

报告题目:电子器件石墨烯碳纳米管互连与散热研究新进展

主讲人:瑞典皇家工程科学院院士 刘建影教授,瑞典查尔莫斯理工大学材料科学与工程学院

报告地点:材料学院后三楼报告厅

报告时间:201871015:00-17:00

邀请人:黄明亮

 

报告摘要:

随着电子工业的发展,集成电路规模朝着提高集成度、减小尺寸及增加时钟频率的趋势发展,集成密度进一步增大,器件集成度提高、性能增强的同时,也带来了大功率,最终导致电子器件单位体积上功耗急剧增加。而功耗大部分转换为热能,致使器件温度显著上升,严重影响其可靠性和使用寿命,“热障”问题日益严峻。目前大规模集成电路芯片表面发热已达到100W/cm2,2013年,一块拥有106个晶体管的典型超大规模集成芯片的发热量将达150W/cm2,而拥有更多大功率器件的复杂大规模集成电路芯片的发热量将高达400W/cm2。2015年,微处理器中的输入/输出数已达到4000个,由此带来的过高温度将降低电子器件的工作稳定性,增加出错率,同时模块内部与其外部环境间所形成的热应力会直接影响到器件的电性能、工作频率、机械强度及可靠性。事实上,不仅对于大规模集成电路器件,光电器件以及近年来发展迅速的微/纳电子机械系统等,都存在着类似的广泛而迫切的散热冷却需要,有的情况下甚至要求更高。本团队重点针对“多摩尔”及“超越摩尔”领域,开展了一系列3D碳基电子系统的互连与散热研究,其中包括碳纳米管3D纵向和横向互连及石墨烯薄膜散热。研究结果展示碳纳米管特别是在其与金属复合后在纵向互连与横向印刷线路时具有高导电率,抗弯曲等明显优势,功能化后的石墨烯基薄膜可用于电子器件高密度横向散热。

 

报告人简历:

     Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently full professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden. As a member of the Royal Swedish Academy of Engineering Sciences and a fellow of IEEE, he has published 500 papers in journals, conference proceedings and book chapters with a Hirsch index of 29 in Web of Science (WoS) and 39 in Google Scholar Citation System (Google Scholar) and with a citation of over 2840 times (WoS) or 6000 (Google Scholar). He has 75 patents accepted or filed and has published 35 papers with impact factor over 3.5 (8 of them over 10) including those in Nature Communications, Advanced Materials and so on. His  research field covers mainly nanoelectronics, microsystems packaging and 3D  additive manufacturing materials and processes including vertical stacking CNT TSV technology, CNT/graphene assisted cooling technology, graphene heat  spreader, high temperature stable conductive adhesives, nano-soldering, nano-thermal interface materials and biomedical nanoscaffolds. He has successfully run over 70 research projects funded by National Science Fundation, Swedish Board for Strategic Research (SSF), Natoinal Swedish Board for Innovation (Vinnova) and Formas, Sweden as well as EU FP6, FP7 and Horizon 2020 programs.